SEMIconductor blades
wafer and package singulation
Dicing | Singulation Blade
Our dicing blades are manufactured by specialty consolidation, sintering and eletro-forming process that improve the uniformity of the thin blades. They are suitable for cutting ceramics,brittle materials ,optical glass,printed circuit boards,especially for Semiconductor and PCB packaging.
| Type | OD (mm) |
Thickness (mm) |
Tolerance | ID (mm) |
Diamond Size | Concentration (um) |
|---|---|---|---|---|---|---|
| Nickel Blades | 50-120 | 0.03-0.05 | +/- 0.002 +/-0.005 |
25.4 40 88.90 |
4/6 5/10 8/20 10/20 15/25 20/30 30/40 36/54 |
30-120 |
| Resin and Metal Blade Resin Bond Metal Bond |
50-80 | 0.1-0.4 0.1-0.7 |
+/-0.005 | 40 | #170 230 325 400 600 800 1000 1500 |
Recomendation
| Specs | Electroformed Bond | Metal Bond | Resin Bond |
|---|---|---|---|
| GC600 |
#400-#1200 |
#400-#1200 |
#400-#1200 |
| GC1000 | #1500-#2000 |
#1500-#2000 |
#1500-#2000 |
| GC2000 | #2000-#3000 |
N/A |
N/A |
| F30 | #1800-#3000 |
N/A |
N/A |
| F40 | #3500-#4500 |
N/A |
N/A |
| F50 | #3500-#4500 |
N/A |
N/A |
| WA400 | N/A |
#320-400 |
N/A |
| WA1000 | N/A |
#1500-#2000 |
N/A |
| WA800 | #600-#1200 |
#400-#1200 |
N/A |
- Address: Toyo Adtec Pte Ltd 24 Sin Ming Lane #04-99 Midview City Singapore 573970
- Phone: + (65) 701 368
- Fax: + (65) 701 369
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