Takatori Corporation | Semiconductor Process Ecosystem
Advanced high-precision manufacturing solutions engineered for thin wafer protection, automated substrate mounting, and innovative Fan-Out Panel Level Packaging (PLP/HBM) configurations.
Fully compatible with clean-room robotic pathways including SECS/GEM, AGV, and OHT cassette automation standards.
Surface Protective Tape Lamination
Affixes automated structural protection films onto wafer front-sides prior to precision abrasive back-grinding (BG) phases. Completely bubble-free performance matching ultra-thin profiles down to 150 µm and Taiko™ requirements.
Our Semiconductor and PCB Films
Various Application and Customizations
Singulation Tape
Secures Chips During cutting; Offers precise UV release.
Backgrinding Film
Supports wafers during thinning; prevents breakage.
Heat Release Film
Supports package dicing; prevents breakage and residue Free.
Toyo Adtec Precision Pre-Cut Dicing Films
Zero Airborne Contam and Perfect Frame Alignment Fit to customer needs.
Backgrind Tapes
Supports wafers during thinning; prevents breakage.