Next-Generation Sorter for Advanced Panel-Level Packaging (PLP)

The SEMES TEPAS100 is the semiconductor industry’s premier, high-speed, high-precision sorter engineered specifically for large-format Panel-Level Packaging (PLP) production lines. As advanced packaging scales to meet the massive demands of AI, high-performance computing (HPC), and dense chip integration, the TEPAS100 delivers an all-in-one automated solution for the final, critical stages of back-end processing.

Core System Workflow

The TEPAS100 seamlessly unifies multiple post-singulation processes into a single, optimized inline system:

Singulation Handling

Panel Extraction

Dices and safely extracts singulated package chips directly from massive 515mm x 510mm panels.

Proprietary Cleaning & Drying

Tornado Blower Technology

Utilizes an exclusive, wide-area Tornado Blower method to achieve high-speed, uniform drying across large panel surfaces immediately after singulation, eliminating moisture and residual debris.

Vision Inspection

Defect Classification

Employs high-resolution, ultra-fast vision inspection systems to dynamically differentiate known-good-die (KGD) from defects.

Precision Sorting

Tray Placement

Sorts and transfers passing chips into high-density shipping or testing trays using rapid, high-accuracy pick-and-place robotics.

Key Technical Advantages

Discover the performance optimizations built directly into the SEMES PLP structural pipeline:

Large Panel Capability

Purpose-built to handle ultra-large 515mm x 510mm panels, unlocking the full throughput advantages of PLP over legacy wafer-level packaging.

Superior Defect & Quality Control

Advanced machine vision ensures absolute accuracy in defect screening, protecting your downstream supply chain and maintaining flawless yield metrics.

Differentiated Productivity

The specialized Tornado Blower drying system dramatically slashes cycle times per panel, preventing the cleaning phase from becoming a throughput bottleneck.