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Loadpoint develop, manufacture and supply high precision dicing machines and machining systems for Semiconductors, Electronics, Ferroelectrics, Opto-electronics and related industries.
Loadpoint's highly versatile and reliable dicing machines set the standards in wafer cutting quality, machining rate and range of operations handled. Loadpoint dicing machines are found in leading electronics companies throughout the world.
Innovative products for manufacturing optical quality surfaces, machining micro features and inspecting and cleaning surfaces are all available.
Loadpoint's highly versatile and reliable dicing machines set the standards in wafer cutting quality, machining rate and range of operations handled. Loadpoint dicing machines are found in leading electronics companies throughout the world.
Innovative products for manufacturing optical quality surfaces, machining micro features and inspecting and cleaning surfaces are all available.
Dicing/Grinding/Drilling/
Milling Machines
Milling Machines
Consumables
Support Products
Servicing and Spares
MicroAce Series 3, NanoAce, NanoAce TNC, PicoAce, MacroAce and Washpoint.
Blades & Spacers, Wafer Mounting, Wafer Mounting Tape and Wafer Shippers.
Blades & Spacers, Wafer Mounting, Wafer Mounting Tape and Wafer Shippers.
Air Bearing Spindles, Chucks, Presspoint, Twin Videoscope and Mist Extractors.
Machines manufactured by Loadpoint over 30 years ago are still in daily use for high precision.