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ATM-3000
Semiconductor Machinery Division
Protective tape laminator for 12-inch (300 mm) wafers.
Partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room.
Consideration for weight saving helps an operator from big burden.
Designed that tape is replaceable at the backside of the machine for easy management.
Interactive mode allows easier operation.
(Option) FOUP cassette, AGT and OHT protocol.
Partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room.
Consideration for weight saving helps an operator from big burden.
Designed that tape is replaceable at the backside of the machine for easy management.
Interactive mode allows easier operation.
(Option) FOUP cassette, AGT and OHT protocol.
ATRM-2100D
Using a specially designed wafer holder,the tape is removed without giving any physical stress to the wafer. (Patent pending)
Wafer of 200 m thickness is applicable.
Use of Optional ultra-violet ray irradiation unit provides the use of UV tape.(UV type)
Wafer of 200 m thickness is applicable.
Use of Optional ultra-violet ray irradiation unit provides the use of UV tape.(UV type)
DM-800B
Laminating die sheet on the backside of a wafer for stacked IC chips.
Ultra thin 8 inch wafer is applicable due to unique wafer handling.
Temperature controlling function for the heater table meets the various conditions of tape.
(Option) Capable of processing 50-100 micron thick wafers.
Ultra thin 8 inch wafer is applicable due to unique wafer handling.
Temperature controlling function for the heater table meets the various conditions of tape.
(Option) Capable of processing 50-100 micron thick wafers.
